Technical Scope & Inspection Capabilities
Non-destructive microscopic evaluation of printed circuit boards (PCBs), surface-mount technology (SMT) assemblies, Ball Grid Arrays (BGA), Quad Flat No-Lead (QFN), flip-chips, and encapsulated electronic components. Detects solder voids, bridging, head-in-pillow (HiP) defects, open joints, bond wire breaks, and internal silicon die package cracks.
Industrial Applications in Chennai
Automotive electronic control units (ECUs), defense and aerospace avionics, medical electronics, EV battery management systems (BMS), and telecommunications hardware.
Frequently Asked Questions (Chennai Region)
What is the maximum permissible solder void percentage in BGA balls under IPC-7095?
IPC-7095 Class 3 allows a maximum of 25% total voiding in the projected ball area. Our digital microfocus X-ray system calculates automated void area percentages with sub-micron accuracy. Our teams serve facilities across Chennai, Chennai & Suburban Districts with Same-day Mobilization (< 2 hours).
Can X-ray inspect multi-layer PCB internal via barrel cracking?
Yes. By utilizing oblique angle viewing and 3D laminography, our X-ray system reveals hairline copper via barrel plating cracks, delaminations, and misaligned internal drill traces. Our teams serve facilities across Chennai, Chennai & Suburban Districts with Same-day Mobilization (< 2 hours).